Anritsu News & Insights | Sept 2026

The Growing Demand for High-Speed Digital Connectivity

Data traffic is growing rapidly due to the spread of AI in a wide range of industries, high-definition video streaming services, advances in autonomous driving technologies, and many others. Furthermore, AI and disaggregation technologies are being introduced in the network and computing fields. The high-speed digital interfaces, including PCI Express® (PCIe®), USB, DDR, and DisplayPort, are the backbone of these technologies. The interfaces are essential for high-speed digital systems such as computing, server, and storage systems, and the performance continues to evolve daily.

The Evolution of High-Speed Digital System R&D

The key R&D targets of high-speed digital systems include chips, functional circuit blocks, electric/photonic wiring, connectors, and so on. Development of these devices is completed after passing through the stages of prototyping, debugging, design verification, and certification compliance testing. During these stages, engineers repeatedly perform the following processes to improve the quality of high-speed digital signals: evaluate digital signal characteristics, identify faults, feed-back to design, prototype debug, final prototype evaluation, and compliance test.

The Core Challenges in High-Speed Digital Systems

Signal degradation due to the characteristics of higher digital signal frequenciesand high-frequency loss characteristics of materials used in transmission lines are the main technical challenges facing high-speed digital systems. The impact of jitter, crosstalk, and degraded Eye characteristics can occasionally cause poor high-speed digital system operation margins. Jitter is variation in timing on the digital-signal time axis, where timing is determined by the frequency, pulse width, duty cycle, and the difference in time between the rise and fall edges of the pulse, caused by various factors such as noise in the circuit and communications path, and changes in other circuits and external equipment. Crosstalk is the phenomenon of signal leakage between adjacent signal wires or buses, and high crosstalk causes poor operation of high-speed digital systems. Eye characteristics can be evaluated from eye diagram, which is a graphical display of the and data stream in serial data signals, used to evaluate the quality of digital signals. Signal integrity problems in high-speed digital system primarily consist of reflection, crosstalk, delay, calling and impedance matching. Cross-coupling, electromagnetic interference (EMI), and ground bounce are major challenges for signal integrity in high-speed layouts.

Comprehensive Test Solutions for High-Speed Digital Systems

These solutions can help resolve challenging issues across various high-speed interface standards, including AI semiconductors, PCIe, CXL, USB, DDR, DisplayPort, and Ethernet. By leveraging advanced test and measurement equipment, engineers can effectively address signal integrity issuesand ensure reliable performance of high-speed digital systems throughout the development cycle. Accurate test fixture characterizationand de-embedding for correct measurements with oscilloscopesand VNAs are essential in high-speed digital applications.

Case Study: Enabling Next-Generation High-Frequency Electronic Circuit Board Manufacturingand Quality Assurance with Anritsu Vector Network Analyzers

Meiko Electronics Vietnam Co., Ltd, a global high performance PCB manufacturer, completes in factory high frequency PCB evaluation using Anritsu's vector network analyzers. The VNAs drive reliabilityand proposal strength, enablingthe company to maintain high quality standardsin high-frequency circuit board production.

Case Study: Qualitas Semiconductor Co., Ltd

Qualitas Semiconductor Co., Ltd, a leading companyin high-speed interconnect IP development, enhanced its verification capabilitiesand development efficiency by leveraging Anritsu's vector network analyzer. This strategic partnership allowedthe company to strengthen its testing infrastructureand accelerate the development of high-speed interconnect solutions.

Case Study: Micro-Star International Co., Ltd (MSI)

Micro-Star International Co., Ltd, through its signal integration department, overcame the technical issues hindering high-speed digital transmissionin the development of cutting-edge PCsand peripheral devices. By utilizing a BER testerand VNA,the company achieved significant improvementsin signal integrityand product reliability, demonstratingthe critical role of advanced test equipmentin modern computing hardware development.

Case Study: Murata Manufacturing Co., Ltd

Murata Manufacturing Co., Ltd addressed electromagnetic noise issuesin USB 3.2 communication, while establishing an evaluation environment compliant with RFI testing specifications. This case demonstrates how proper test methodologiesand equipment can resolve real-world signal integrity challengesin high-speed digital interfaces, ensuring compliance with industry standardsand reliable product performance.

Press Release: ETRI Selects Anritsu VectorStar™ ME7838G for High-Frequency Evaluation

Anritsu is pleased to announce thatthe Electronics and Telecommunications Research Institute(ETRI, a leading Korean research institution, has selected the Anritsu VectorStar™ ME7838G broadband vector network analyzerfor high-frequency device evaluation. The VectorStar ME7838G enables reliable broadband characterizationand design verification of GaN MMICsfor millimeter-waveand sub-THz applications. By deployingthe ME7838G, ETRI has developed an evaluation platformfor millimeter-waveand sub-THz applications, improving measurement reproducibilityand enabling reliable design verification. The ME7838G supports single-sweep measurements upto 220 GHz, allowing engineers to examine a wide frequency range without movingthe device between independent test systemsas measurement frequency increases. This continuity is important because useful semiconductor characterisation can extend well beyond a device's intended operating band, including harmonics, parasitic effects, impedance behaviour, matching networks,and non-linear performance. ETRI is conducting broadband measurements covering both operatingand harmonic frequency ranges, using on-wafer techniqueswhere probes contact structures directly onthe semiconductor wafer, reducingthe influence of packageand mounting effects. Since broadband evaluation can be completed through a single measurement system, ETRI has established an on-wafer evaluation platformthat enables measurements from millimeter-wave to sub-THz frequenciesunder consistent test conditions, without switching between different frequency bands. This allows ETRI to compare broadband measurement data with simulated resultsunder more consistent conditions, helping engineers distinguish genuine device behaviour from changes introduced bythe measurement configuration.

Upcoming Event: SNW 2026

The No.1 annual eventfor the global subsea telecoms industry, Submarine Networks World offers you an subsea-specific platform to exchange knowledge, explorethe latest projects, develop strategiesand form new partnershipsto continue keepingthe world connected. At SNW 2026, meet with 1000+ industry professionals, from every inhabited continent, all gathering herein Singaporefor the annual 'must-attend' event. Onstage, hear from 150+ subsea speakers participatingon panelsand individually presenting across 7 theatres, each providing sector-specific conference content. The Main Hall features 80+ sponsors& exhibitors, creating a genuine hub of business activitywith every part ofthe subsea telecoms value-chain. Expect inspirational keynotes, livelyand thought-provoking debates, to hear new ideasand create new connections, all herein Singaporein September. The event will take place on 23-24 September 2026at the Sands Expo& Convention Centre, Singapore.

Technical Webinar: Beyond S-Parameters–AI-Powered RF Characterization with Tensor VNA

RFand microwave measurementis entering a new era, driven by increasingly complex devices, evolving test requirements,andthe needfor greater measurement efficiency. Traditional S-parameter analysis remains essential, but today's engineers are lookingfor new waysto gain deeper insightinto device performance. In this webinar, Anritsu will explorethe evolution of next-generation RF characterization, including SDR-like measurement approaches, active device characterization,andthe application of AI to simplifyand enhance measurement workflows. Key topics include why RF measurements need a new approach,the evolution of next-generation VNA technology,SDR-like VNA capabilities beyond S-parameters, active device characterization beyond S-parameters,and AI-powered productivityand measurement experience. The webinar will be held on Oct 15, 2026at 09:30 AM in Asia/Barnaul. Join us to explore how new measurement approaches can provide deeper insights, improve efficiency,and address the evolving challenges of RFand microwave designand testing.

Video: MP1900A PCIe 6.0 Compliance Test

The Signal Quality Analyzer MP1900A is a certified tester to support PCIe 1.0 to PCIe 6.0 receiver testswith a new automation functionfor compliance testing. The MP1900A PCIe 6.0 solution provides each presetand compliance test pattern required by PCIe 6.0,andalso has a built-in SKP filter. This demonstration video showcases the USB4 v2 compliance test usingthe MP1900A, along with PCIe 6.0 debuggingand validation capabilities. Additional resources includethe MP1900A PN Skew Evaluation Solution Demonstration Videoandthe MP1900A PCIe® 6.0 Rxand Tx LEQ Tests Demonstration Video, which introducesthe Return Path Optimization Function ofthe MP1900A, covering Link Training, BER/Jitter Tolerance Test, Tx LEQ Response Test,and new FEC features.